SkinPen Microneedling

 How does microneedling work? It creates thousands of microchannels that stimulate your body’s natural wound healing process, while minimizing cellular damage. This rejuvenates your skin from the inside out. The result is effective remodeling of scar tissue, while keeping the overall structure of the skin intact.

 With minimal physical discomfort, most clients are able to do the procedure without numbing cream and without any noticeable pain. There is no lingering discomfort, and we have a number of strategies we employ to minimize discomfort during treatment. Post-procedure, most people report a “tight” feeling in their skin. 

 As microneedling treatments are minimally invasive, they are also safe for all skin types. Whether you are fair-skinned or dark, and even if you experience chronic breakouts, properly conducted microneedling treatments will not result in hyperpigmentation, keloid scars, or other lasting negative side effects. 

 Microneedling treatments can improve the appearance of fine lines and wrinkles, hyperpigmentation, acne scarring, stretch marks, and rosacea. Microneedling is also effective at hair regrowth. 

 Though neocollagenesis (the production of new collagen) can take several weeks, it is not abnormal to notice an improvement in the quality and appearance of your skin within the first 24 hours. After 2-3 treatments a thicker more robust, collagen filled cellular matrix will produce more consistent and noticeable improvement. And 6 or more treatments may be recommended for scarring, laxity and wrinkles. 

 If you have any underlying condition that significantly impairs your immune system, it is a good idea to avoid microneedling. Examples include but are not limited to active radiation or chemotherapy, uncontrolled diabetes, chronic inflammatory skin disease, Accutane in the past 2 years, hemophilia or similar bleeding disorder. Also anyone with stainless steel allergies should not do this treatment. We also discourage treatments for those who are pregnant or nursing.